In addition to in-house support from the electrical test floor in validation of device functionality, we routinely provide electrical data for a device under failure analysis to the customer prior to opening or decapsulation.


​Scanning Electronic Microscope (SEM), X-ray fluorescence (XRF), energy dispersive X-ray spectrometry (EDX), and C-mode Scanning Acoustic Microscopy (CSAM) are used to perform in-depth failure and materials analysis on hermetic and plastic devices. We can perform material analysis on any type of material, including continuous fiber reinforced composites, ceramics, and polymers. In addition to in-house support from the electrical test floor in validation of device functionality, we routinely provide electrical data for a device under failure analysis to the customer prior to opening or decapsulation.

About

Destructive Physical Analysis and Failure Analysis

DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures. We perform complete disassembly, testing, and inspection of all types of EEE components in conformance with exact customer design or process requirements. Standards mostly used in our DPA process are: MIL-STD-1580, SSQ25000, MIL-STD-883.​


From removal of encapsulants to internal visual inspections after cross section, different types of operations are performed as a part of our Destructive Physical Analysis (DPA) process. Our standard DPA program includes taking external photos, leak test, electrical tests, delidding, internal photos, bond pull testing, SEM, X-Ray, EDXA, XRF, cross section visual examination, and a series of mechanical as well as environmental tests as applicable. This rigorous process of sample testing establishes a baseline specification and ensures that a high reliability component or device is fabricated to the required standards.


Scanning Electronic Microscope (SEM), X-ray fluorescence (XRF), energy dispersive X-ray spectrometry (EDX), and C-mode Scanning Acoustic Microscopy (CSAM) are used to perform in-depth failure and materials analysis on hermetic and plastic devices. We can perform material analysis on any type of material, including continuous fiber reinforced composites, ceramics,
​and polymers.

Location: 2251 Ward Ave. Simi valley CA 93065
Call Us Today

805.581.9200

Contact Us: 805.581.9200  |  info@dpaci.com  

DPA Components International Provides Manufacturing, Assembly, Test, Screening & Qualification of Custom High-Reliability Electronic Components

DPA Components Intl. 2251 Ward Avenue, Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
​info@dpaci.com

Certifications &
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