Location: 2251 Ward Ave. Simi valley CA 93065
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805.581.9200

Contact Us: 805.581.9200  |  info@dpaci.com  

DPA Components International Provides Manufacturing, Assembly, Test, Screening & Qualification of Custom High-Reliability Electronic Components

DPA Components Intl. 2251 Ward Avenue, Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
​info@dpaci.com

Certifications &
Capabilities

We perform all die preparation, sample assembly, evaluation and test per Table C-II in-house with full traceability and MIL-STD-883 DSCC Laboratory Certification. Allow DPACI to provide a Turn-Key Solution to your custom hybrid or MCM needs.

About

Trusted Semiconductor Die/Wafer Source

DPACI is a Trusted Source accredited by DMEA.  Because of DPACI’s unique position of being both a customer of and a supplier of services to several major memory manufacturers; we are a source to provide a Turn-Key Solution to your high density memory requirements.​

To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die / wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die / Wafer. For specific products please reference the dpaci.com web site or search Cypress.com or Samsungsemi.com for your needs. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.


One more advantage of using DPACI for your wafer / die source is the ability to obtain die or elemental evaluation certification in accordance with MIL-PRF-38534 directly with one order. Elemental Evaluation in accordance with Table C-II of M38534 is performed to certify the wafer lot to be Class H or Class K compliance in accordance with MIL-PRF-38534 for the use in hybrids and multichip modules. Our standard die evaluation for H and K certification is as follows:

  1. Sample selection per method 2018 of MIL-STD-883.
  2. Package and prepare die in accordance with C.3.3.3.2 of MIL-PRF-38534.
  3. Perform die evaluation per MIL-PRF-38534 paragraph C.3.3.6.6, Table C-II for Class H or Class K as applicable.
  4. Test report with read and record data of die evaluation.
  5. Certification of wafer traceability lot to Class H or Class K requirements.