We perform all manufacturing processes required to package monolithic microcircuits in conformance with DSCC approved procedures and processes under our MIL-PRF-38535 QML “Q” and “V” level manufacturing lines.
In-process monitors such as destructive and non-destructive bond pull, die stud pull, 100% visuals, first article electricals, residual gas analysis and hermeticity are carried out as routine in-line assembly processes in our clean room facility. Using modern assembly equipment, highly skilled personnel, rigorous discipline with expert training and testing certifications, DPACI offers a unique Turn-Key Solution to the high reliability custom parts industry.
The DSCC certified team at DPACI performs all part assembly, qualification, screening, testing and analysis in-house, under one roof to facilitate throughput and visibility for our customer’s mission critical requirements.
DPA Components International Provides Manufacturing, Assembly, Test, Screening & Qualification of Custom High-Reliability Electronic Components
Specializing in providing Turn-Key Solutions, we offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room to perform all assembly operations from wafer processing to final hermetic package seal. Packaging and assembly of custom microcircuits and hybrids conforming to Class "B", “H” and Class "S", “K” requirements of MIL-PRF-38535, MIL-PRF-38534 and MIL-STD-883 is the initial phase of a Turn-Key Solution effort. Screening, qualification, and testing/analysis ensures that the product to meets mission critical requirements of customer applications. Experienced quality control personnel in our AS9100 infrastructure are involved in every step of the process flow, from first article testing to final inspection with total traceability, produces higher yields with precision and repeatability.