Testing/Screening |  DPA/Failure Analysis  |  Radiation Testing  |  Component Engineering |  Obsolete Parts  |  Manufacturing

 


Testing/Screening

DPACI performs screening and qualification tests to specific customer or military drawings. We have extensive experience in the procurement and upscreening of high reliability components from Industrial/Commercial to Military and Space Level.

Microcircuits – Class B, Class S in accordance with MIL-PRF-38585,
MIL-STD-883 Method 5004 for 100% screening and Method 5005 for Quality Conformance Inspection (QCI)




Discrete Semiconductors - JAN, JANTX, JANTXV, JANS equivalent in accordance with MIL-PRF-19500, Mil-Std-750 for 100% screening and QCI.

Hybrids - Tested in accordance with customer specifications.
DPACI performs all parts testing in-house using our own ISO-trained and certified personnel (with the exception of Residual Gas Analysis (RGA) and Radiation Testing for which we contract with partners specializing in these areas).

Our Testing and Screening capabilities include:
  1. Industrial/Commercial to Class B and Class B to Class S Upgrades
  2. Electronic Components Testing/Screening
  3. Quality Conformance Inspection (QCI) in accordance with applicable specifications
  4. Complete in-house Test Fixture Design and Fabrication
  5. Static and Dynamic Test Fixture Inventory and Custom Burn-In Board Archive
  6. Comprehensive Environmental Stress Testing for electronic piece parts
  7. HAST (Highly Accelerated Stress Testing) for Pems
  8. All the above to support our manufactured product (microcircuits and hybrids)

Test Fixtures - We provide all of the required test fixtures, test procedures, mechanical, environmental and electrical test equipment. Our in-house fixture fabrication department is complete from design on CAD to manufacturing our own printed circuit boards for test fixtures and burn-in, populating them with device sockets/connectors and other electronic components to support the assurance testing effort.

Quality Conformance Inspection - DPACI offers the Quality Conformance Inspection (QCI) and Qualification tests required to fully qualify a new product in a MIL-PRF-38535 QML facility with DSCC approval. We can perform QCI to the requirement of MIL-PRF-38535, MIL-PRF-19500. With our Total Solutions approach of keeping complete capabilities in-house we can better control program costs and minimize schedule delays. Test failures and subsequent re-test requirements can be readily witnessed and reviewed for quick corrective action.



Component Testing ServicesScreening (100%)
Temperature Cycle / Shock
Constant Acceleration
Particle Impact Noise Detection Electricals
Burn-In and High Temperature
Reverse Bias
Fine and Gross Leak
Radiographic Inspection
Marking / Serialization
External Visual
Electricals

QCI (Sampling)
Physical Dimensions
Internal Water Vapor
Resistance to Solvents
Internal Visual / SEM
Destructive Bond Pull

Die Shear Strength
Substrate Attach
Solderability
Lead IntegrityLid TorqueLife Test
HAST (Highly Accelerated Stress Testing)
Electrical End Points
Moisture Resistance (RGA)*
Mechanical Shock
Vibration
Salt Atmosphere
Adhesion to Lead Finish
Radiation Test*
ESD Sensitivity Class
( * =outsourced )


100% Screening Process Flow
Typical B Level Screen
1. External Visual
2. Temperature Cycling / Shock
3. Acceleration
4. Initial Electricals (25c)
5. Static Power Burn-In (160h)
6. Final Electricals (25, -55, 125c)
7. Percent Defective Allowable
8. Hermetic Seal, Fine and Gross
9. Part Marking
10. QCI per M38535

Typical S Level Screen
1. External Visual
2. Temperature Cycling / Shock
3. Acceleration
4. Particle Impact Noise Detection (PIND)
5. Initial Electricals (25c)

6. High Temperature Reverse Bias (HTRB)
7. Interim Electricals (25c)
8. Dynamic Burn-In (240h)
9. Post Burn-In Electricals
10. Delta Calculations
11. Final Electricals (-55, 25, 125c)
12. Percent Defective Allowable
13. Radiography
14. Hermetic Seal, Fine & Gross
15. Part Marking
16. Final Documentation
17. QCI per M38535
18. HAST for Pems


DSCC Lab Suitability Tests

Moisture Resistance
Steady State Life Test
Salt Atmosphere
Temperature Cycling
Thermal Shock
Seal / Leak Test
Burn-In Test
Internal Water Vapor
Constant Acceleration
Mechanical Shock
Solderability
Lead Integrity
Vibration, Variable
Freq. External Visual


Destructive Bond Strength
Radiography
Internal Visual for DPA
Internal Visual and Mechanical
Resistance to Solvents
Physical Dimensions
SEM-Destructive
Die Shear
Particle Impact Noise Detection
Non-Destructive Bond Pull
Lid Torque
Adhesion of Lead Finish
Substrate Attachment Strength
PGA Destructive Lead Pull
ESD Sensitivity Class
Electrical Tests

883 Method
1004
1005/A-E
1009/A
1010/C
1011/B
1014/A1, C1
1015/A-E
1018
2001/D, E, (Y1)
2002/B
2003
2004/B
2007/A
2009

883 Method
2011/D
2012
2013
2014
2015
2016
2018
2019
2020/A, B
2023
2024
2025
2027
2028
3015
PARA. 4.5.9




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