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When alternate parts are not available, DPACI can manufacture hard-to-find replacements using custom packaging, hybridizing existing designs, die recovery, or redesign.
- Wafer/Die Qualification - DPACI utilizes QML foundries globally to obtain qualified wafers and dice to support customers with non-standard part requirements.
- Die Recovery - DPACI has a patent pending die recovery process, DPEM/DCEM (De-encapsulate Plastic/Ceramic Encapsulated Module), for successfully retrieving die from plastic or ceramic packaged parts. The DPEM solution can save hundreds of thousands of dollars over reinventing the device and offers extremely rapid turnaround. A DPEM device can meet all the requirements of military and space level specifications in terms of form, fit, function, quality and reliability.
- Emulation/Design - DPACI works closely with Tanner Research for emulation and ASIC design using their Manuflex Shared Mask Gate Array (SMGA) process. This highly cost-effective fabrication reduces economical minimum quantities to 100 pieces for full custom designs.
- DPEM - DPACI can remove die from plastic parts via a patent pending process called DPEM and repackage it into a new ceramic or plastic package and retain it's total integrity. We have on file reliability test data and customer testimonials for this proprietary process (see our DPEM section).
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