Turn-Key Custom Assembly, Packaging and QualificationComponent Testing and
Screening
Destructive Physical
Analysis and Failure
Analysis
QML Memory 5962-
Products
DPACI Memory OfferingRF Testing, Screening and
Qualification
Counterfeit Analysis
Services
EEE Parts ManagementPatented DPEM Process
for Die Removal
Wafer/Die Certified Source
DPA Components Intl.
2251 Ward Avenue,
Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
info@dpaci.com

DPACI Memory Offering

Military, Space, & Heavy Industrial

Density SCD# SMD# Die/Wafer N Q V
Static Ram            
144 MB X   X      
72 MB X X X X   X
36 MB X X X X    
18 MB X X X   X  
16 MB X X X X X  
8 MB X X X X X  
4 MB X X X X X X
2 MB X X X X X  
1 MB X   X      

Density SCD# SMD# Die/Wafer N Q V
Dynamic Ram            
DDR3 X   X      
4 GB X   X      
2 GB X   X      
1 GB X   X      
DDR2 X   X      
2 GB X   X      
1 GB X   X      
512 MB X          
DDR X          
512 MB X          
256 MB X          

Density SCD# SMD# Die/Wafer N Q V
Flash Ram (NAND)            
32 GB X   X      
16 GB X   X      
8 GB X   X      
4 GB X   X      
2 GB X   X      


Flash Ram (NOR):
Customer will need to contact DPACI.
SCD: Product built in a certified Q & V  level facility with factory direct die.
SMD: QML - 38535 product available at customer request.









54 Pin TSOP Package

click to enlarge

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