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We are continually upgrading our manufacturing and testing capabilities. QML product assurance level Q was granted to DPACI by DSCC in January 1998 for assembly and test of M38535 microcircuits. QML product assurance level V was granted by DSCC in April 2000 for assembly and test of M38535 microcircuits.
 All assembly operations take place in our self-contained, stand-alone Class 10,000 clean room. Highly skilled personnel perform all assembly processes under Class 100 laminar flow hoods, using state-of-the-art assembly equipment.
Manufacturing processes required to package monolithic microcircuits, semiconductors and hybrids are performed to documented procedures, inspected to exacting specifications by experienced quality control personnel and include First Article Testing within the clean room environment.
The manufacturing processes that we perform in our clean room include:
- Wafer Processing
- Die Attaching
- Wire Bonding
- First Article Validation
- In-Line Inspection
- Quality / Reliability Testing
- Package Sealing
 QML Line Assembly - Processes
Internal Visual
Non-Destructive
Bond Pull
Die Attach
· Silver Glass
· Eutectic
· Epoxy (Hybrids only)
Wire Bonding
· Gold Ball
· Aluminum Wedge
· Ribbon |
Lid Seal
· Projection Weld
· Solder Reflow
· Roller Seam Seal
Fine and Gross Leak
First Article Electricals |
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QML Assembly Process Flow
Typical Q Level
1. 100% Visual Inspection
2. Die Attach
3. Die Shear (Sample)
4. Wire Bonding
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5. Bond Pull (Sample)
6. Lid Seal
7. Fine and Gross Leak Tests
8. First Article Electricals |
Typical V Level
1. 100% Visual Inspection
2. Die Attach
3. Die Shear (Sample)
4. Wire Bonding
5. ND Bond Pull (100%)
6. Lid Seal
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7. Fine and Gross Leak Tests
8. First Article Electricals
9. Temperature Cycle
10. 100% Electricals
11. Acceleration (Sample)
12. 100% Electricals |
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