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 Destructive Physical Analysis (DPA) - This rigorous process of sample testing establishes a baseline specification and ensures that a high reliability component or device is fabricated to the required standards. Key steps in this process include taking external photos, delidding, internal photos, scanning electron microscope inspection, Energy Dispersive X-ray Analysis (EDXA) and bond pull testing.
Failure Analysis - DPACI's extensive failure analysis capabilities provide critical support to our own in-house manufacturing efforts and offer an unparalleled resource to our customers for analysis of their component and equipment problems. By thoroughly analyzing failure modes, solutions to difficult production problems can be identified early, before they show up as widespread device or component failures.
Materials Analysis - DPACI is fully equipped to perform in-depth materials analysis. Our capabilities for materials analysis include, but are not limited to, continuous fiber reinforced composites, ceramics, and polymers. Materials analysis uses the same rigorous methods that are used in all of our analysis procedures.
 Radiation Construction Analysis - This procedure was developed as a turnkey solution to validate radiation tolerance for non-standard semiconductor parts with radiation tolerant requirements. Radiation construction analysis is used to select those devices exhibiting the best apparent radiation hardening characteristics from the candidate parts of various manufacturers. The risk of lot failure is minimized with construction analysis performed on candidate sources and sample rad testing performed on the selected source. A new SID and process flow is generated to document how DPACI meets the intent of the specification MIL-PRF-38535.
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